Mold epoxy adhesive is a high-strength, heat-resistant bonding material used specifically for manufacturing carbon fiber and fiberglass molds in drone production. It offers excellent adhesion, dimensional stability, and durability, making it ideal for UAV mold fabrication and repair.
Key Features:
High temperature resistance for mold curing cycles (80–150°C).
Strong structural bonding, preventing deformation or cracking.
Low shrinkage, ensuring accurate mold dimensions.
Chemical resistance to withstand epoxy or polyester resins.
Easy to sand, polish, and shape after curing.
Carbon fiber drone mold fabrication
Fiberglass mold reinforcement and repair
Mold edge sealing and cavity bonding
Surface defect filling
Small-scale composite part production
